surface mount multilayer chip capacitors www.vishay.com for technical questions contact mlcc@visha y .com document number 28501 2 revision 18-sep-03 class 1 np0 10/16/25/50/100 v vishay bccomponents features ? ultra stable class 1 dielectric ? four standard sizes ? high capacitance per unit volume ? supplied in tape on reel ? for high frequency applications ? ni-barrier with 100 % tin terminations applications ? consumer electronics ? telecommunications ? data processing general specifications note: electrical characteristics values - temperature at 20 ?1 ?, pressure at 86 to 106 kpa and humidity at 63 to 67 % unless otherwise stated rated voltage u r (dc): 10 v; 16 v; 25 v; 50 v; 100 v capacitance range: 1.0 pf to 0.039 ? tolerance on capacitance: c 10 pf = ?1 %; ?2 %; ?5 %; ?10 % c < 10 pf = ?0.1 pf; ?0.5 pf; ?0.25 pf tolerance on capacitance (cont): q 30 pf = q 1000 q < 30 pf = q 400 + 20c temperature coefficient: ?30 ppm/ ? insulation resistance after 120 seconds at u r (dc): 10 g ? minimum or 500 ? f minimum, whichever is less climatic category (iec 68): 55/125/56 t l mb mb w dimensions in inches [millimeters] size code lw t max. mb 0402 0.040 0.002 [1.0 0.05] 0.020 0.002 [0.5 0.05] 0.022 [0.55] 0.010 + 0.002/- 0.004 [0.25 + 0.05/- 0.1] 0603 0.063 0.004 [1.6 0.10] 0.030 0.003 [0.8 0.07] 0.035 [0.87] 0.015 0.006 [0.40 0.15] 0805 0.080 0.006 [2.0 0.15] 0.050 0.004 [1.25 0.10] 0.053 [1.35] 0.020 0.008 [0.50 0.20] 1206 0.125 0.006 [3.2 0.15] 0.063 0.006 [1.6 0.15] 0.063 ?0.008 [1.6 ?0.20] 0.069 [1.8] 0.025 0.008 [0.60 0.20] ordering information vj0402 a 101 j x q c w1bc size code dielectric capacitance tolerance termination voltage packaging technology 0402 0603 0805 1206 a = cog (np0) two signi?ant digits f ollowed by the n umber of zeros: 101 = 100 102 = 1000 152 = 1500 103 = 10000 b = ?0.1 pf c = ?0.25 pf d = ?0.50 pf f = ?1 % g = ?2 % j = ?5 % k = ?10 % x = ni barrier q = 10 v j = 16 v x = 25 v a = 50 v b = 100 v c = 7 inches reel/paper p = 13 inches reel/paper t = 7 inches reel/blister r = 13 inches reel/blister
class 1 np0 10/16/25/50/100 v surface mount multilayer chip capacitors vishay bccomponents document number 28501 for technical questions contact mlcc@visha y .com www.vishay.com revision 18-sep-03 3 selection chart for 10/16/25/50 and 100 v dielectric npo eia cap size 0402 0603 0805 1206 code vdc w 10 v 16 v 25 v 50 v 100 v 10 v 16 v 25 v 50 v 100 v 10 v 16 v 25 v 50 v 100 v 10 v 16 v 25 v 50 v 100 v 0r5 0.5 pf nnnn ssss s aaaa a 1r0 1.0 nnnn ssss s aaaa a 1r2 1.2 nnnn ssss s aaaa a 1r5 1.5 nnnn ssss s aaaa a bbbb b 1r8 1.8 nnnn ssss s aaaa a bbbb b 2r2 2.2 nnnn ssss s aaaa a bbbb b 2r7 2.7 nnnn ssss s aaaa a bbbb b 3r3 3.3 nnnn ssss s aaaa a bbbb b 3r9 3.9 nnnn ssss s aaaa a bbbb b 4r7 4.7 nnnn ssss s aaaa a bbbb b 5r6 5.6 nnnn ssss s aaaa a bbbb b 6r8 6.8 nnnn ssss s aaaa a bbbb b 8r2 8.2 nnnn ssss s aaaa a bbbb b 100 10 pf nnnn ssss s aaaa a bbbb b 120 12 nnnn ssss s aaaa a bbbb b 150 15 nnnn ssss s aaaa a bbbb b 180 18 nnnn ssss s aaaa a bbbb b 220 22 nnnn ssss s aaaa a bbbb b 270 27 nnnn ssss s aaaa a bbbb b 330 33 nnnn ssss s aaaa a bbbb b 390 39 nnnn ssss s aaaa a bbbb b 470 47 nnnn ssss s aaaa a bbbb b 560 56 nnnn ssss s aaaa a bbbb b 680 68 nnnn ssss s aaaa a bbbb b 820 82 nnnn ssss s aaaa a bbbb b 101 100 pf nnnn ssss s aaaa a bbbb b 121 120 nnnn ssss s aaaa a bbbb b 151 150 nnnn ssss s aaaa a bbbb b 181 180 nnn ssss s aaaa a bbbb b 221 220 nnn ssss s aaaa a bbbb b 271 270 nn ssss s aaaa a bbbb b 331 330 nn ssss s aaaa a bbbb b 391 390 nn ssss s bbbb b bbbb b 471 470 nn ssss s bbbb b bbbb b 561 560 ssss s bbbb b bbbb b 681 680 ssss bbbb b bbbb b 821 820 ssss bbbb b bbbb b 102 1 000 pf ssss bbbb b bbbb b 122 1 200 ss bbbb b bbbb b 152 1 500 ss bbbb b bbbb b 182 1 800 ss bbbb b bbbb b 222 2 200 ss bbbb b bbbb b 272 2 700 ss dddd d bbbb b 332 3 300 ss dddd d bbbb b 392 3 900 dddd d bbbb b 472 4 700 ddd bbbb b 562 5 600 dd bbbb b 682 6 800 dd cccc c 822 8 200 dd cccc c 103 0.01 ? d d dddd 123 0.012 d d d d 153 0.015 dd 183 0.018 dd 223 0.022 dd 273 0.027 dd 333 0.033 dd 393 0.039 gg 473 0.047 563 0.056 683 0.068 823 0.082 104 0.1 ?
www.vishay.com for technical questions contact mlcc@visha y .com document number 28501 4 revision 18-sep-03 class 1 np0 10/16/25/50/100 v vishay bccomponents surface mount multilayer chip capacitors packaging quantities thickness c lassification (mm) amount per reel ? ? ? ? 180 mm; 7 inch 0402 0603 0805 1206 a = 0.6 ?0.1 - - paper 4 kp/reel - b = 0.8 ?0.1 - - paper 4 kp/reel paper 4 kp/reel c = 0.95 ?0.1 - - - plastic 3 kp/reel d = 1.25 ?0.1 - - plastic 3 kp/reel plastic 3 kp/reel g = 1.60 ?0.2 - - - plastic 2 kp/reel s = 0.8 ?0.07 - paper 4 kp/reel - - n = 0.50 ?0.05 paper 10 kp/reel - - - k = 2.00 ?0.2 ---- m = 2.5 ?0.30 ---- packaging quantities thickness c lassification (mm) amount per reel ? ? ? ? 330 mm; 13 inch 0402 0603 0805 1206 a = 0.6 ?0.1 - - paper 15 kp/reel - b = 0.8 ?0.1 - - paper 15 kp/reel paper 15 kp/reel c = 0.95 ?0.1 - - - plastic 10 kp/reel d = 1.25 ?0.1 - - plastic 10 kp/reel plastic 10 kp/reel g = 1.60 ?0.2 ---- s = 0.8 ?0.07 - paper 15 kp/reel - - n = 0.50 ?0.05 paper 50 kp/reel - - - k = 2.00 ?0.2 ---- m = 2.5 ?0.30 ---- cover tape (polyester - antistatic) carrier tape (polycarbonate) properties of cover tape p arameter width 5.5 0.1 mm breaking force 10.7 n elongation at break 63 % surface resistance < 10 10 ? /sq. softening point 71 5 ? thickness 62 m properties of carrier tape p arameter width 8.1 0.2 mm thickness 190 to 280 ? t ensile strength at break > 60 n /mm 2 elongation at break 100 to 150 % surface resistance > 10 12 ? /sq. paper tape specifications f w p 0 p 2 d 0 b 0 a 0 p 1 e dimensions of paper tape in millimeters symbol product size code 0402 0603 0805 1206 size tol. size tol. size tol. size tol. a 0 0.62 ?0.05 1.02 ?0.05 1.50 ?0.10 2.00 ?0.15 b 0 1.12 ?0.05 1.82 ?0.05 2.30 ?0.10 3.50 ?0.15 w 8.00 ?0.10 8.00 ?0.10 8.00 ?0.10 8.00 ?0.10 e 1.75 ?0.10 1.75 ?0.10 1.75 ?0.10 1.75 ?0.10 f 3.50 ?0.05 3.50 ?0.05 3.50 ?0.05 3.50 ?0.05 d 0 1.55 ?0.05 1.55 ?0.05 1.55 ?0.05 1.55 ?0.05 p 0 4.00 ?0.10 4.00 ?0.10 4.00 ?0.10 4.00 ?0.10 p 1 2.00 ?0.05 4.00 ?0.10 4.00 ?0.10 4.00 ?0.10 p 2 2.00 ?0.05 2.00 ?0.05 2.00 ?0.05 2.00 ?0.05
class 1 np0 10/16/25/50/100 v surface mount multilayer chip capacitors vishay bccomponents document number 28501 for technical questions contact mlcc@visha y .com www.vishay.com revision 18-sep-03 5 blister tape specifications e f w p 2 p 0 d 0 b 0 a 0 d 1 p 1 direction of unreeling dimensions of blister tape in millimeters dimension product t olerance 0805 1206 a 0 < 1.55 < 2.00 - b 0 < 2.45 < 3.60 - w 8.00 8.00 ?0.20 e 1.75 1.75 ?0.10 f 3.50 3.50 ?0.05 d 0 1.50 1.50 + 0.10/ - 0 d 1 1.00 1.00 ?0.10 p 0 4.00 4.00 ?0.05 p 1 4.00 4.00 ?0.10 p 2 2.00 2.00 ?0.05 reel specifications dc b a method of mounting and dimensions of solder lands for normal use the capacitors may be mounted on printed-circuit boards or ceramic substrates by applying wave soldering and reflow soldering. an improper combination of soldering, substrate and chip size can lead to a damaging of the component. the risk increases with the chip size and with temperature fluctuations (> 100 ?) therefore, it is advised to use the smallest possible size and follo w the dimensional recommendations given. reel dimensions and tape width in millimeters ? ? ? ? 180 mm; 7 inch ? ? ? ? 330 mm; 13 inch a 13.0 1.0 13.0 0.5 b 9.0 1.0 9.0 0.5 c 178.0 1.0 330.0 1.0 d 60.5 1.0 100.0 1.0
www.vishay.com for technical questions contact mlcc@visha y .com document number 28501 6 revision 18-sep-03 class 1 np0 10/16/25/50/100 v vishay bccomponents surface mount multilayer chip capacitors soldering graphs ir reflow with snagcu soldering ir reflow with snpb solder 300 250 200 150 100 50 0 ( c) time sn-ag-cu solder paste max temperature t 60 ~ 120 seconds 60 ~ 120 seconds 60 ~ 120 seconds 30 ~ 60 sec min temperature 300 250 200 150 100 50 0 ( c) time sn-pb eutectic solder paste max temperature t 30 ~ 60 seconds 30 ~ 60 seconds 30 ~ 60 seconds min temperature > 215 c: 20 ~ 40 seconds wave soldering reflow soldering 050 100 150 200 250 300 250 200 150 100 50 0 10 s 235 c to 260 c second wave 5 k/s 2 k/s first wave 200 k/s 100 c to 130 c forced cooling 2 k/s ( c) t (s) t 050 100 150 200 250 300 250 200 150 100 50 0 10 s 260 c 130 c ( c) t (s) 245 c 215 c 180 c 10 s 40 s 2 k/s t r ecommended dimensions of solder lands in millimeters e b a f c dg preferred direction during wave soldering solder land / solder paste pattern solder resist pattern occupied area tracks
class 1 np0 10/16/25/50/100 v surface mount multilayer chip capacitors vishay bccomponents document number 28501 for technical questions contact mlcc@visha y .com www.vishay.com revision 18-sep-03 7 reflow soldering size code footprint dimensions in mm processing remarks placement a ccuracy abcdefg 0402 1.50 0.50 0.50 0.50 0.10 1.75 0.95 ir or hot plate soldering ?0.15 0603 2.30 0.70 0.80 0.80 0.20 2.55 1.40 ?0.25 0805 2.80 1.00 0.90 1.30 0.40 3.08 1.85 ?0.25 1206 4.00 2.20 0.90 1.60 1.60 4.25 2.25 ?0.25 w ave soldering size code footprint dimensions in mm proposed number and dimensions of dummy tracks (mm) placement a ccuracy (mm) a bcdefg 0603 2.40 1.00 0.70 0.80 0.20 3.10 1.90 1 x (0.2 x 0.8) ?0.10 0805 3.20 1.40 0.90 1.30 0.36 4.10 2.50 1 x (0.3 x 1.3) ?0.15 1206 4.80 2.30 1.25 1.70 1.25 5.90 3.20 3 x (0.25 x 1.7) ?0.25 t ests and requirements t est conditions in static solder bath parameter description solderability 95 % covered with smooth and bright solder coating cecc requirement: 235 5 ? for 2 0.5 seconds iec requirement: 215 3 ? for 3 0.3 seconds resistance to leaching 10 % of the metallization of the edges of the head face may be missing (inner electrodes are not visible) 260 5 ? for 30 1 second t est procedures and requirements test procedure requirements visual and mechanical no visible damage dimensions in accordance with speci?ation capacitance c 1000 pf, 1.0 0.2 v rms ; f = 1 mhz 10 % c > 1000 pf, 1.0 0.2 v rms ; f = 1 khz 10 % shall not exceed the limits given in the detailed speci?ation q value c 1000 pf, 1.0 0.2 v rms ; f = 1 mhz 10 % c > 1000 pf, 1.0 0.2 v rms ; f = 1 khz 10 % 30 pf: q 1000 < 30 pf: q 400 + 20c dielectric strength 250 % of rated voltage for 1 to 5 seconds, charge and discharge current less than 50 ma no visible damage or ?sh-over during test insulation resistance at u r (dc) for maximum 120 seconds 10 g ? minimum or 500 ? f minimum, whichever is less t emperature coef?ient with no electrical load: ? 55 to 125 c at t amb = 25 c ?30 ppm/? bending test the middle part of the substrate shall be pressurized by means of the pressurizing rod at a rate of about 1 mm per second until the de?ction becomes 1 mm and then the pressure shall be maintained for 5 1 second measurement after 24 2 hours at room temperature no visible damage ? c/c: 5.0 maximum or 0.5 pf maximum, whichever is greater this capacitance change means the change of capacitance under speci?d ?xure of substrate from the capacitance measured before the test solderability 230 5 ? for 2 0.5 seconds; solder: sn63a 95 % minimum coverage of entire metallized area
www.vishay.com for technical questions contact mlcc@visha y .com document number 28501 8 revision 18-sep-03 class 1 np0 10/16/25/50/100 v vishay bccomponents surface mount multilayer chip capacitors resistance to soldering heat 260 5 ? for 10 1 second; solder: sn63a; measurement after 24 2 hours at room temperature preheating: 120 to 150 ? for 1 minute before immerse the capacitor in a eutectic solder. no visible damage ? c/c: 2.5 % maximum or 0.25 pf maximum, whichever is greater df, r ins and dielectric strength to meet initial requirements t emperature cycle ? 55 to 125 c; 5 cycles in the following sequence: ? 55 c ? 3/+ 0 for 30 ?3 minutes; room temperature for 2 to 3 minutes; 125 c + 3/ ? 0 for 30 ?3 minutes; room temperature for 2 to 3 minutes measurement after 24 2 hours at room temperature no visible damage ? c/c: 2.5 % maximum or 0.25 pf maximum, whichever is greater df, r ins and dielectric strength to meet initial requirements humidity test (damp heat steady state) 40 2 ?; 90 to 95 % rh for 500 + 24/ ? 0 hours u r applied; measurement after 24 2 hours at room temperature no visual damage ? c/c: 5.0 % maximum or 0.5 pf maximum, whichever is greater q: 30 pf q 350 10 pf c < 30 pf, q 275 + 2.5c < 10 pf, q 200 + 10c r ins : 1 g ? minimum or 50 ? f minimum, whichever is less humidity load (damp heat) 40 2 ?; 90 to 95 % rh for 500 + 24/ ? 0 hours u r applied; measurement after 24 2 hours at room temperature no visual damage ? c/c: 7.5 % maximum or 0.75 pf maximum, whichever is greater q: 30 pf, q 200 c < 30 pf, q 100 + 10/3c r ins : 500 m ? minimum or 25 ? f minimum, whichever is less adhesive strength of termination pressurizing force 5 n ( 0603) and 10 n (> 0603) test time 10 1 second no visible damage vibration resistance f requency: 10 to 55 hz/minute; t otal amplitude: 1.5 mm t est time: 6 hours (2 hours each in 3 mutually perpendicular directions) no visible damage or removal of the terminations capacitance change and df: to meet initial requirements high temperature load (endurance) t est temperature: 125 3 c; 200 % of rated voltage for 1000 + 24/ ? 0 hours; measurement after 24 2 hours at room temperature no visual damage ? c/c: 3 % maximum or 0.3 pf maximum, whichever is greater q: 30 pf, q 350 10 pf c < 30 pf, q 275 + 2.5c c < 10 pf, q 200 + 10c r ins : 1 g ? minimum or 50 ? f minimum, whichever is less t est procedures and requirements test procedure requirements
|
